Diamond / CBN blades for the precision cutting of wafer, magnetic head, IC, LSI, optical biber etc.Resin, metal and electroformed bonds
Our factory is a world leader in the development and manufacturer of dicing blades and processes used in the dicing of silicon-based ICs, hard material Microelectronic Components (MECs) and in package singulation.
Nickel-bond Dicing Blades
The Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as:PCB, Silicon and BGA
Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size)
Diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness)
Resin-bond Dicing Blades
Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as:QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)
Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness).
Taizhou Sumeng Grinding Wheel Co., Ltd. (including Jiangsu Subei Grinding Wheel Factory Co. Ltd, Bondflex Abrasives Co Ltd, SUZHOU SAILI PRECISION TOOLS CO Ltd) is leading factory specialized in manufacturing bonded abrasive products and Superabrasives tool, large O. D. Reinforced Cutting Wheels, Crankshaft Grinding Wheels, Cutting and Grinding Discs, Diamond & CBN Wheels, TCT Saw Blades, Diamond Tools etc.
